QUAD FLAT NON-LEAD PACKAGE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140299978A1
SERIAL NO

14244352

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Abstract

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A quad flat non-lead package includes a chip, a chip carrier including a bearing surface adapted for the mounting of the chip, a plurality of leads mounted around the chip carrier and electrically connected to the chip, each lead having an opening located in an outer edge of a rear end thereof, and a molding compound formed on the chip, the chip carrier and the leads by compression molding to let the opening of each lead be exposed to the outside. The design of the openings of the leads can provide more tin-climbing area to improve soldering quality and yield, thereby lowering the manufacturing cost and facilitating testing after the soldering process. The invention also provides a lead frame for quad flat non-lead package.

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Patent Owner(s)

Patent OwnerAddress
LINGSEN PRECISION INDUSTRIES LTDT E P Z

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LIAO, Mu-Tsan TAICHUNG CITY, TW 3 3

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