Tunable Polish Rates By Varying Dissolved Oxygen Content
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United States of America Patent
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Oct 9, 2014
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Jun 19, 2014
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May 28, 2010
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A system for tunable removal rates and selectivity of materials during chemical-mechanical polishing using a chemical slurry or solution with increased dissolved oxygen content. The slurry can optionally include additives to improve removal rate and/or selectivity. Further selectivity can be obtained by varying the concentration and type of abrasives in the slurry, using lower operating pressure, using different pads, or using other additives in the dispersion at specific pH values.
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