PHOTOSENSITIVE RESIN COMPOSITION
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United States of America Patent
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Issued Date -
Oct 2, 2014
app pub date -
Mar 25, 2014
filing date -
Mar 26, 2013
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Abstract
A photosensitive resin composition includes a carboxyl group-containing photosensitive resin, a photopolymerization initiator, a compound having an ethylenic unsaturated group, a non-reactive diluent, and an epoxy compound. The photopolymerization initiator includes an oxime ester compound and an aminocarbonyl compound having a tertiary amino group.
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