ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

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United States of America Patent

APP PUB NO 20140292143A1
SERIAL NO

14217503

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The disclosure provides an electronic device that includes a substrate and a lid. The lid is bonded on the substrate to seal an inside of the lid using a resin. The lid includes a contact surface in contact with the resin. The contact surface includes a rough surface with an uneven shape.

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Patent Owner(s)

Patent OwnerAddress
NIHON DEMPA KOGYO CO LTDJAPAN TOKYO ZHONG 1-47-1 SHIBUYA DISTRICT SASAGAWA (ZIP CODE 151-8569) TOKYO TOKYO METROPOLIS

International Classification(s)

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  • 2014 Application Filing Year
  • H01L Class
  • 23828 Applications Filed
  • 21803 Patents Issued To-Date
  • 91.51 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2014201520162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichikawa, Ryoichi Saitama, JP 42 288

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Patent Citation Ranking

  • 7 Citation Count
  • H01L Class
  • 7.09 % this patent is cited more than
  • 11 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges7625916189582342423416712683684320001 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0500100015002000250030003500400045005000550060006500

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