Semiconductor Device
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United States of America Patent
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Issued Date -
Oct 2, 2014
app pub date -
Mar 19, 2014
filing date -
Mar 28, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor device of this disclosure includes: a circuit element mounted on a main face of a lead frame; an inductor mounted on a back face of the lead frame; and a resin body sealing the circuit element and the inductor; wherein the circuit element includes a thermo-sensitive element and has an overheating protection function of the inductor.
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