SPUTTERING APPARATUS
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United States of America Patent
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app pub date -
Jun 13, 2014
filing date -
Dec 16, 2011
priority date (Note) -
Abandoned
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Abstract
A sputtering apparatus includes a power application device configured to apply power to set a cathode body and a cathode magnet to an equipotential. The power to be applied to the cathode magnet is supplied via a spline arranged between the cathode body and a magnet rotating shaft attached to the cathode magnet.
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