HEAT DISSIPATING PAD
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United States of America Patent
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Issued Date -
Oct 2, 2014
app pub date -
Mar 31, 2013
filing date -
Mar 31, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat dissipating pad includes a pad body and a fan. The pad body has a hollow accommodating recess and a first fixing structure disposed on a side of the hollow accommodating recess. The fan includes a fan frame. The fan frame is detachably disposed in the hollow accommodating recess and has a second fixing structure. When the fan frame is disposed at a predetermined position in the hollow accommodating recess, the first fixing structure and the second fixing structure are fixed with each other so as to prevent the fan frame from coming off the hollow accommodating recess.
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