BUILDING BOARD AND METHOD FOR PRODUCING BUILDING BOARD

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United States of America Patent

APP PUB NO 20140287220A1
SERIAL NO

14101176

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A building board includes an inorganic board having a surface covered by an insulating coating film containing a coating film forming material and organic hollow particles, wherein the organic hollow particles have an average particle size in the range of 5 to 50 μm and an average hollow ratio of 80% or more, and the insulating coating film contains 0 01 to 5.0 parts by mass of the organic hollow particles per 100 parts by mass of solid content thereof, and has an average thickness of 5 to 500 μm. The method for producing a building board includes: applying, onto a surface of an inorganic board, an insulating coating material containing a coating film forming material and organic hollow particles; and drying the insulating coating material to form an insulating coating film.

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Patent Owner(s)

Patent OwnerAddress
NICHIHA CORPORATION12 SHIOTOME-CHO MINATO-KU NAGOYA-SI AICHI 4558550 JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IMAI, Toshio Nagoya-shi, JP 54 303
YAMAMOTO, Hiroaki Nagoya-shi, JP 438 4133

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