THERMALLY ADHESIVE POLYIMIDE FILM AND METHOD FOR PRODUCING SAME, AND POLYIMIDE METAL LAMINATE PRODUCED USING THERMALLY ADHESIVE POLYIMIDE FILM
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United States of America Patent
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Issued Date -
Sep 25, 2014
app pub date -
Aug 17, 2012
filing date -
Aug 25, 2011
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Abandoned
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Abstract
A single-layered thermally adhesive polyimide film; a method for producing the thermally adhesive polyimide film; and a method for producing a polyimide metal laminate produced using the thermally adhesive polyimide film. The single-layer thermally adhesive polyimide film is produced by polymerizing a tetracarboxylic acid dianhydride component and a diamine component, wherein the tetracarboxylic acid dianhydride component includes 2,3,3′,4′-biphenyltetracarboxylic acid dianhydride and 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride and the diamine component includes an aromatic diamine compound represented by the following formula (I) as a main component
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