SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20140285273A1
SERIAL NO

13939083

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to one embodiment, there is provided a semiconductor device including a first capacitance electrode, a second capacitance electrode, and a depletion layer. The first capacitance electrode is buried in a hole via an insulating film. The hole is formed in a semiconductor substrate. The second capacitance electrode is formed on a front surface side or on a back surface side of the semiconductor substrate so as to be separated from the first capacitance electrode. The depletion layer forming mechanism includes a control electrode, and forms a depletion layer between the first capacitance electrode and the second capacitance electrode.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBATOKYO

International Classification(s)

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  • 2013 Application Filing Year
  • H03B Class
  • 411 Applications Filed
  • 377 Patents Issued To-Date
  • 91.73 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2013201420152016201720180255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ENDO, Mitsuyoshi Kanagawa, JP 29 363

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  • H03B Class
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges242246111933101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6071 - 800102030405060708090100110120130140150160170180190200210220230240

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