APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES
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United States of America Patent
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Issued Date -
Sep 25, 2014
app pub date -
Mar 22, 2013
filing date -
Mar 22, 2013
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Abstract
An apparatus for liquid treatment of substrates, comprises a substrate holder and a liquid collector surrounding the substrate holder. The liquid collector comprises a trough for collecting liquid that has been used to treat a substrate. The trough is in fluid communication with a discharge conduit, and the liquid collector further comprising a recessed surface extending from a discharge opening in the trough to an inlet opening of the discharge conduit that is positioned lower than the trough. The discharge opening in the trough has a cross-sectional area that is at least twice as large in cross sectional area than the inlet opening of the discharge conduit.
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