Wafer Edge Protector
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United States of America Patent
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Issued Date -
Sep 25, 2014
app pub date -
Mar 20, 2013
filing date -
Mar 20, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wafer edge protector is used in an inductively coupled plasma reactive ion etching instrument for the manufacturing of GaN semiconductor devices and circuits. The wafer edge protector comprises a ring clamp, which has a first inner diameter and a second inner diameter, and the ring clamp covers the edges of a wafer and a wafer carrier to clamp the wafer and the wafer carrier and to prevent damage on the edges of the wafer and the wafer carrier during the etching process.
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