METHOD FOR PRODUCING A SUBSTRATE PROVIDED WITH EDGE PROTECTION
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United States of America Patent
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Issued Date -
Sep 18, 2014
app pub date -
Mar 18, 2014
filing date -
Mar 15, 2013
priority date (Note) -
Abandoned
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Abstract
The method for producing a substrate provided with protection of its edges has a first step which is providing a substrate having a semiconductor material base. The substrate has opposite first and second main surfaces connected by a lateral surface. A first layer made from first protective material is then formed so as to coat the substrate. The first protective material is then etched on the lateral surface leaving a pattern of first protective material at least partially covering each of the first and second surfaces, and a second protective layer made from second protective material is then formed on the lateral surface devoid of the first protective material. After formation of the second protective layer, the first protective material is eliminated from the substrate.
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