ADHESIVE COMPOSTIONS WITH WIDE SERVICE TEMPERATURE WINDOW AND USE THEREOF
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United States of America Patent
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Sep 18, 2014
app pub date -
Mar 12, 2013
filing date -
Mar 12, 2013
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The invention provides hot melt adhesives comprising (A) a mixture of polymers consisting of (1) an amorphous alpha olefin, (2) an ethylene copolymer that has a Tg value equal to or less than −35° C.; and (3) a styrene block copolymer; and (B) a polyethylene wax grafted with a functional group. These hot melt adhesives have high heat resistance and good low temperature performance, making them particularly well suited for end-of-line packaging application.
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