DIE BONDER AND BONDING HEAD DEVICE OF THE SAME, AND ALSO COLLET POSITION ADJUSTING METHOD
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United States of America Patent
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Issued Date -
Sep 18, 2014
app pub date -
Sep 12, 2013
filing date -
Mar 15, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
For providing a die bonder, a bonding head device and a collet position adjusting method for enabling an automatic correction (adjustment) of errors, including height and inclination thereof, when exchanging a collet, with a simple structure thereof, in the bonding head device, having a holder 41h for guiding a vacuum for suction in an inside thereof, a shank 41s and a collet 41c, detachably attached at a tip of the holder, for adjusting the position of the collet after exchange of the collet, a reverse-side surface of that collet is photographed, before exchanging it, by a reverse-side surface photographing camera 42, which is disposed below the bonding head device, and after the exchange of the collet, the reverse-side surface of that collet exchanged, and then correction is made on positions of the collets, so that pictures photographed before/after the exchange thereof come to be coincident with.
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