CHIP ARRANGEMENTS, CHIP PACKAGES, AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Mar 15, 2013
filing date -
Mar 15, 2013
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A chip arrangement may include a semiconductor chip; an encapsulation layer at least partially encapsulating the semiconductor chip, the encapsulation layer having a receiving region configured to receive an electronic device, the receiving region comprising a cavity; and an electronic device disposed in the receiving region.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully