Packaging for an electronic device
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United States of America Patent
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Nov 17, 2015
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app pub date -
Mar 15, 2013
filing date -
Mar 15, 2013
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Abstract
In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.
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