PACKAGE SUBSTRATE AND METHOD FOR TESTING THE SAME
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United States of America Patent
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Issued Date -
Sep 18, 2014
app pub date -
Mar 18, 2013
filing date -
Mar 18, 2013
priority date (Note) -
Abandoned
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Abstract
A package substrate is provided, including a board body having a wiring region and a testing region defined thereon, conductive pads embedded in the wiring region, and a plurality of testing pads disposed in the testing region and electrically connected to the conductive pads, wherein the top surface area of each of the testing pads is greater than the top surface area of each of the conductive pads in order to facilitate a precise alignment of a probe with a corresponding one of the testing pads and prevent the probe from being blocked by the board body when in electrically testing an embedded circuit.
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