Thermoplastic Resin Composition Having Excellent EMI Shielding Property
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United States of America Patent
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Sep 18, 2014
app pub date -
Feb 19, 2014
filing date -
Mar 15, 2013
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A thermoplastic resin composition includes (A) about 50 to about 90% by weight of a crystalline thermoplastic resin having a melting point of about 200 to about 380° C.; and (B) about 10 to about 50% by weight of a filler in which a carbon nanostructure having an average length of about 1 to about 1000 μm and an average diameter of about 1 to about 100 nm is grown on a glass fiber surface. The thermoplastic resin composition can have excellent EMI shielding property and/or fluidity.
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