HIGH THROUGHPUT SCAN DEFLECTOR AND METHOD OF MANUFACTURING THEREOF
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United States of America Patent
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Issued Date -
Sep 18, 2014
app pub date -
Jul 2, 2013
filing date -
Mar 15, 2013
priority date (Note) -
Abandoned
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Abstract
A magnetic deflector assembly configured for scanning a primary electron beam and providing an upgrade kit for a wafer imaging system is described. The assembly includes at least one magnetic deflector for scanning the beam over the wafer in one direction, wherein the at least one magnetic deflector comprises at least two coils forming a pair of the at least two coils, wherein the number of turns in the at least two coils is 8 or less and wherein a maximum dimension of a cross-section of a coil-forming wire or of a coil forming conductor is 0.2 mm or less.
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