METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
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United States of America Patent
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Issued Date -
Sep 18, 2014
app pub date -
Nov 25, 2013
filing date -
Mar 15, 2013
priority date (Note) -
Abandoned
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Abstract
A method for manufacturing a package substrate is provided, including etching a substrate to form trenches each having a buffer portion, and forming a circuit in each of the trenches. The trenches are formed by etching instead of excimer laser to increase the aspect ratio of the trench, thereby solving the problem that the metallic layer is not thick enough and achieving a high yield of the circuit and a good process capability index.
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