Metal Deposition Process Using Electroplasma

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United States of America Patent

APP PUB NO 20140262802A1
SERIAL NO

14216154

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A process for treating a surface of an electrically conductive workpiece is provided, comprising placing a movable workpiece within a reaction chamber, wherein the reaction chamber includes an anode, and wherein the workpiece is a cathode; creating a gap between the anode and the cathode, wherein the anode includes a plurality of orifices; applying an aqueous electrolyte into the reaction chamber through the orifices in the anode and onto the workpiece, and applying the aqueous electrolyte from below the workpiece, to establish an electrically conductive medium around the workpiece, applying a DC voltage to the electrically conductive medium in excess of 30 VDC, such that a foam is formed within the reaction chamber, wherein the foam comprises a gas/vapor phase and a liquid phase which fills the entire reaction chamber; adjusting the voltage to establish an electro-plasma discharge between the anode and workpiece, sufficient to cause positive ions in the electrically conductive medium to become concentrated near the surface of the workpiece and cause micro-zonal melting of the surface in the area of discreet plasma bubbles; and moving the workpiece through the reaction chamber and away from the electrically conductive medium to allow re-freezing of the molten surface of the workpiece. The process applies to both cleaning and coating of the workpiece, wherein coating is achieved via sacrificial anodes.

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Patent Owner(s)

Patent OwnerAddress
CAP TECHNOLOGIES LLC609 CENTERVILLE STREET N E DENHAM SPRINGS LA 70726

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Daigle, Edward O Denham Springs, US 5 7
George, Pratheesh Denham Springs, US 3 1

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