MULTI-LAYER CORE ORGANIC PACKAGE SUBSTRATE
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United States of America Patent
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Issued Date -
Sep 18, 2014
app pub date -
Mar 14, 2013
filing date -
Mar 14, 2013
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Abandoned
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Abstract
A multi-layer core organic package substrate includes: a multi-layer core comprising at least two organic core layers, wherein two of the at least two organic core layers are separated by a core metal layer; a first plurality of build-up layers formed on top of the multi-core layer; and a second plurality of build-up layers formed below the multi-core layer.
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