DETAPING PROCESS FOR FOILS TAPED ON SEMICONDUCTOR WAFERS
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United States of America Patent
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Issued Date -
Sep 18, 2014
app pub date -
Mar 12, 2013
filing date -
Mar 12, 2013
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Abandoned
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Abstract
The invention concerns a detaping process for a protective foil taped onto a front-side of a semiconductor wafer, this detaping process comprising the successive steps of:
- A) introducing the wafer and the protective foil taped onto the front-side of the semiconductor wafer into an electrically dissipative liquid or into an electrically dissipative solid-state medium having a flowing behavior substantially similar to the one of a liquid;B) removing the protective foil when the wafer is into the electrically dissipative liquid or into the electrically dissipative solid-state medium.
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