Microwave Sealing Of Inorganic Substrates Using Low Melting Glass Systems
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United States of America Patent
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Issued Date -
Sep 18, 2014
app pub date -
Nov 1, 2012
filing date -
Nov 2, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A frit-based hermetic sealing system for sealing glass plates to one another, or sealing glass to ceramics is disclosed. Seal materials, the methods to apply these seal materials, and the seal designs for selective and controlled absorption of microwave energy to heat and seal the system are presented. The hermetic seals are useful in various applications such as (a) encapsulating solar cells based on silicon, organic systems, and thin film, (b) encapsulating other electronic devices such as organic LEDs, (c) producing Vacuum Insulated Glass windows, and (d) architectural windows and automotive glass.
First Claim
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