Thermal Interface Structure for Thermoelectric Devices
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United States of America Patent
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Issued Date -
Sep 18, 2014
app pub date -
Mar 13, 2014
filing date -
Mar 14, 2013
priority date (Note) -
Abandoned
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Abstract
A thermoelectric power generating module incorporates compliance into the module using a three-dimensional flexible connector. The flexible connector may relieve thermal stress and improve reliability for thermoelectric modules. In addition, the connector may provide a buffer layer (e.g., cushion) to damp mechanical vibrations. In further embodiments, a thermal interface structure for a thermoelectric device includes a thermally conductive body comprising a first compliant surface for directly interfacing with a first component of the thermoelectric device and a second compliant surface, opposite the first surface, for directly interfacing with a second component of the thermoelectric device.
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