BANDSAW CUTTING APPARTUS AND METHOD FOR CUTTING INGOT

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United States of America Patent

APP PUB NO 20140261368A1
SERIAL NO

14351942

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Abstract

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The present invention provides a bandsaw cutting apparatus including an actuator configured to move static pressure pads forward and backward in a rotating direction of a blade, and a controller configured to control a movement distance and a movement speed of the static pressure pads to be moved by the actuator, wherein the ingot is cut by feeding the blade relatively downward toward and below the ingot while a rotating blade is guided with static pressure pads, and the movement of the static pressure pads is controlled with the controller. The apparatus can stably suppress a displacement of the blade during cutting, thereby cutting the ingot into blocks or sample wafers for crystal quality evaluation stably with good quality cut surface at a higher cutting rate and extending the lifetime of the blade.

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Patent Owner(s)

Patent OwnerAddress
SHIN-ETSU HANDOTAI CO LTD2-1 OHTEMACHI 2-CHOME CHIYODA-KU TOKYO 100-0004

International Classification(s)

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  • 2012 Application Filing Year
  • B28D Class
  • 93 Applications Filed
  • 77 Patents Issued To-Date
  • 82.80 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20122013201420152016201720180255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakagawa, Kazuya Sabae-shi, JP 69 491

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  • 1 Citation Count
  • B28D Class
  • 13.51 % this patent is cited more than
  • 11 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1051651101 - 1011 - 2021 - 3081 - 9091 - 10002.557.51012.51517.52022.52527.53032.53537.54042.54547.55052.555

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