MODULAR ASSEMBLY FOR COUPLING ELECTROCHEMICAL UNITS
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United States of America Patent
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Issued Date -
Sep 11, 2014
app pub date -
Mar 10, 2014
filing date -
Mar 8, 2013
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a modular assembly for coupling electrochemical units, including at least one module including a support frame for receiving at least two electrochemical units, the support frame including main fluidic connection means for coupling between juxtaposed modules and secondary fluidic connection means with the electrochemical units borne by the support frame.
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