AUTOMATIC MANUFACTURING PROCESS FOR PROVIDING BUFFER PADS FOR A PCB AND PCB STRUCTURE USING THE SAME
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United States of America Patent
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Issued Date -
Sep 11, 2014
app pub date -
Aug 19, 2013
filing date -
Mar 7, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An automatic manufacturing process for providing buffer pads (40) for a PCB (10), includes a) providing the PCB (10); b) providing an automatic dispensing device and an adhesive (30); c) using the automatic dispensing device to dispense the adhesive (30) to a buffer zone (12) on the PCB (10); d) providing a pick-and-place machine and the buffer pads (40); e) using the pick-and-place machine to place the buffer pads (40) on the buffer zone (12) moistened with the adhesive (30); and f) curing the adhesive (30) to attach the buffer pads (40) to the PCB (10). Thus, labor is saved and manufacturing time is reduced.
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