METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGES
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United States of America Patent
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Issued Date -
Sep 4, 2014
app pub date -
Feb 25, 2014
filing date -
Mar 1, 2013
priority date (Note) -
Abandoned
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Abstract
A method for manufacturing LED packages includes steps: providing a lead frame including many pairs of first, second electrodes and first and second tie bars, the first electrodes and second electrodes each including a main body and an extension electrode protruding outward from the main body; forming many molded bodies to engage with the first and second electrodes, the first and second main bodies being embedded into the molded bodies, and the first and second extension electrodes being exposed out from a periphery of the molded body; preforming two first through grooves at joints where each first electrode meets the first tie bar and two second through grooves at joints where each second electrode meets the second tie bar; disposing LED dies in corresponding receiving cavities; and cutting the molded bodies through the grooves to obtain a plurality of individual LED packages.
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