CIRCUIT BOARD STRUCTURE HAVING ELECTRONIC COMPONENTS EMBEDDED THEREIN AND METHOD OF FABRICATING THE SAME
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United States of America Patent
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Issued Date -
Sep 4, 2014
app pub date -
Jun 7, 2013
filing date -
Mar 1, 2013
priority date (Note) -
Abandoned
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Abstract
A circuit board structure having electronic components embedded therein and a method of fabricating the same are provided. The circuit board structure includes a substrate having a first circuit layer formed on at least one surface thereof, electronic components electrically connected to the first circuit through a metallic connector, a first dielectric layer formed on the first circuit layer of the substrate and having a plurality of dielectric layer cavities for the first circuit layer to be exposed therefrom and the electronic components to be received therein, a plurality of vias, a second dielectric layer formed on the first dielectric layer and the electronic components and having a plurality of dielectric layer vias for the electronic components to be exposed therefrom and the vias to be formed therein, and a second circuit layer formed on the second dielectric layer and electrically connected to the electronic components through the vias.
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