Chip on Chip Attach (Passive IPD and PMIC) Flip Chip BGA Using New Cavity BGA Substrate
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United States of America Patent
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app pub date -
Mar 8, 2013
filing date -
Mar 4, 2013
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Abandoned
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Abstract
An integrated passive device and power management integrated circuit are directly connected, active surface to active surface, resulting in a pyramid die stack. The die stack is flip-chip attached to a laminate substrate having a cavity drilled therein wherein the smaller die fits into the cavity. The die to die attach is not limited to IPD and PMIC and can be used for other die types as required.
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