IN-SITU SPUTTERING APPARATUS
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United States of America Patent
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app pub date -
Mar 15, 2013
filing date -
Mar 1, 2013
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Abstract
A sputtering apparatus that includes at least a target presented as an inner surface of a confinement structure, the inner surface of the confinement structure is preferably an internal wall of a circular tube. A cathode is disposed adjacent the internal wall of the circular tube. The cathode preferably provides a hollow core, within which a magnetron is disposed. Preferably, an actuator is attached to the magnetron, wherein a position of the magnetron within the hollow core is altered upon activation of the actuator. Additionally, a carriage supporting the cathode and communicating with the target is preferably provided, and a cable bundle interacting with the cathode and linked to a cable bundle take up mechanism provides power and coolant to the cathode, magnetron, actuator and an anode of the sputtering apparatus.
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