ONE COMPONENT, DUAL-CURE ADHESIVE FOR USE IN ELECTRONICS
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United States of America Patent
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app pub date -
Jul 19, 2012
filing date -
Jul 22, 2011
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Abandoned
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Abstract
The disclosure relates to one-component, dual-cure adhesive compositions that include a combination of moisture curable functionalities and radiation curable functionalities where the adhesive could include (1) a moisture-curable prepolymer and a radiation-curable component; or (2) a moisture curable radiation curable prepolymer including moisture curable functionalities and radiation curable functionalities, and optionally an additional moisture-curable prepolymer and/or an additional radiation-curable component. The disclosed adhesives can be used on substrates with electronic components to make electronic assemblies.
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