ELECTROPLATING BATH

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140238868A1
SERIAL NO

13776692

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Compositions suitable for the electrodeposition of copper on substrates, such as electronic device substrates, are provided. Methods of depositing copper layers on surfaces and filling apertures with copper are also provided.

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Patent Owner(s)

Patent OwnerAddress
DOW GLOBAL TECHNOLOGIES LLC2211 H H DOW WAY MIDLAND MI 48674

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LAITAR, David S Midland, US 33 144
LI, Tina C Framingham, US 4 15
MIKKOLA, Robert D Grafton, US 15 244
ROMER, Duane R Midland, US 57 261

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