HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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N/A
Issued Date -
Aug 28, 2014
app pub date -
Feb 22, 2013
filing date -
Feb 22, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of manufacturing a heat dissipating device includes steps of providing a base, wherein the base includes a clamping portion, a supporting portion and two side portions, the clamping portion is arc-shaped, a first recess structure is formed on an outer surface toward an inner surface of each side portion, the two side portions connect the clamping portion and the supporting portion, and an accommodating space is formed between the clamping portion, the supporting portion and the two side portions; disposing a first end of a heat pipe in the accommodating space, wherein the first end is supported on the supporting portion; and punching the clamping portion toward the supporting portion such that the clamping portion cooperates with the supporting portion to clamp the first end in a tight-fitting manner, wherein the clamping portion is capable of deforming through the first recess structure during punch processing.
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