MEASUREMENT METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE
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United States of America Patent
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Issued Date -
Aug 21, 2014
app pub date -
Oct 16, 2013
filing date -
Feb 20, 2013
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Abstract
A measurement method for a junction-to-case thermal resistance is provided. First, a first transient cooling curve of the chip for the semiconductor device under test (DUT) without grease is measured. Then a second transient cooling curve of the chip for the DUT with grease is measured. A difference ΔT of temperature variations of the two transient cooling curves with and without grease is calculated. The temperature of a constant temperature cold plate for fixing the semiconductor DUT is increased by ΔT, and a third transient cooling curve of the chip for the DUT with grease is measured again. The first transient cooling curve and the third transient cooling curve are used to calculate the junction-to-case thermal resistance.
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