NON-CONVENTIONAL METHOD OF SILICON WAFER SAWING USING A PLURALITY OF WAFER SAW ROTATIONAL ANGLES
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United States of America Patent
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Issued Date -
Aug 21, 2014
app pub date -
Feb 18, 2013
filing date -
Feb 18, 2013
priority date (Note) -
Abandoned
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Abstract
A silicon wafer saw can be set to either three or four different cutting angle orientations from a zero degree reference to produce integrated circuit dice having corners greater than 90 degrees. Three different saw angle orientations will produce six sided dice, and four different saw cutting angle orientations will produce eight sided dice.
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