METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
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United States of America Patent
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Issued Date -
Aug 21, 2014
app pub date -
Jan 14, 2014
filing date -
Feb 21, 2013
priority date (Note) -
Abandoned
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Abstract
Provided is a method of fabricating a semiconductor package, including preparing a die including a first metal layer and a second metal layer which are sequentially stacked on a silicon substrate, preparing a package substrate including a lead frame, and forming an adhesive layer between the lead frame and the first metal layer and attaching the die to the package substrate, wherein the forming of the adhesive layer is performed by eutectic bonding between the silicon substrate and the second metal layer. According to the semiconductor package according to an embodiment of the present invention, an adhesive layer can be easily formed by eutectic bonding without a process of forming a preform.
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