ALUMINUM RESIN BONDED BODY AND PROCESS FOR PRODUCING SAME

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United States of America Patent

APP PUB NO 20140234631A1
SERIAL NO

14347001

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is an aluminum-resin bonded body that expresses excellent bonding strength and does not show a reduction in the strength after a durability test, thus being able to keep the excellent bonding strength over a long period of time. The aluminum-resin bonded body includes: an aluminum substrate formed of aluminum or an aluminum alloy; an oxygen-containing film containing oxygen, which is formed on a surface of the aluminum substrate; and a molded resin formed of a thermoplastic resin, which is bonded onto the oxygen-containing film. The thermoplastic resin is a thermoplastic resin containing an element having an unshared electron pair in a repeat unit and/or at an end.

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Patent Owner(s)

Patent OwnerAddress
NIPPON LIGHT METAL COMPANY LTDTOKYO 105-0004

International Classification(s)

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  • 2012 Application Filing Year
  • B29C Class
  • 3499 Applications Filed
  • 2678 Patents Issued To-Date
  • 76.54 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20122013201420152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Endo, Masanori Shizuoka-shi, JP 46 417
Iino, Masaki Tokyo, JP 2 6
Isobe, Masashi Shizuoka-shi, JP 19 292
Yoshida, Miyuki Shizuoka-shi, JP 7 71

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  • 5 Citation Count
  • B29C Class
  • 13.84 % this patent is cited more than
  • 11 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges191947139492397452401 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 90100 +0501001502002503003504004505005506006507007508008509009501000

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