FLEXIBLE POWERED CARDS AND DEVICES, AND METHODS OF MANUFACTURING FLEXIBLE POWERED CARDS AND DEVICES
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United States of America Patent
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Issued Date -
Aug 21, 2014
app pub date -
Feb 19, 2013
filing date -
Feb 19, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A flexible device, such as a powered card or processor based system, may include a flexible assembly. The flexible assembly may include a die adhered to a flexible substrate (e.g., a PCB) by a flexible adhesive. The die may be stacked with other dies that may be adhered to each other with a flexible adhesive. A conductive pad may be between a flexible substrate and a flexible adhesive. Bond wires may interconnect one or more dies and the flexible substrate via bond pads. In a stacked die configuration, the dies may be thinned using a thinning and/or a polishing process. Such thinned dies may be flexible. The flexible assembly may be flexibly encapsulated.
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