Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes
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United States of America Patent
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Issued Date -
Aug 21, 2014
app pub date -
Apr 23, 2014
filing date -
Feb 4, 2003
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Abstract
Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
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