Ultrathin Laminates
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United States of America Patent
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Issued Date -
Aug 21, 2014
app pub date -
Mar 4, 2014
filing date -
Feb 24, 2011
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Abstract
Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils.
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