COMPOSITIONS USEFUL FOR PREPARING COMPOSITES AND COMPOSITES PRODUCED THEREWITH
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United States of America Patent
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Issued Date -
Aug 14, 2014
app pub date -
Feb 13, 2013
filing date -
Feb 13, 2013
priority date (Note) -
Abandoned
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Abstract
A thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) a liquid oligomeric butadiene homopolymer; and (4) a curing agent including one or more alkylphenol novolac resins or alkyphenol co-novolac resins, and one or more poly(2,6-dimethyl-1,4-phenylene oxides), which resin composition may be used to prepare composites, prepregs, or laminates.
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