HEAT DISSIPATION STRUCTURE, POWER MODULE, METHOD OF MANUFACTURING HEAT DISSIPATION STRUCTURE, AND METHOD OF MANUFACTURING POWER MODULE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 14, 2014
app pub date -
Sep 20, 2012
filing date -
Sep 28, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A heat dissipation structure includes a ceramic substrate having an insulation quality, a metal member containing a metal or an alloy and joined to a surface of the ceramic substrate by a brazing material, a metal film layer formed by accelerating a powder containing a metal or an alloy with a gas and by spraying and depositing the powder in a solid phase state on a surface of the metal member, and a heat pipe that is in a rod shape and capable of controlling a temperature and comprises a heat absorbing unit configured to absorb heat from outside at one end of the heat pipe and a heat dissipating unit configured to dissipate heat to the outside at another end of the heat pipe, wherein the heat absorbing unit is embedded inside the metal film layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully