PRECURSOR SUBSTRATE, FLEXIBLE CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140224528A1
SERIAL NO

13852002

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a flexible circuit board, comprising at least a multilayer unit disposed on a substrate, wherein the multilayer unit includes: an adhesion enhancing layer formed within the surface of the substrate, a first electrical conducting unit disposed on the adhesion enhancing layer, and a second electrical conducting layer formed on the first electrical conducting layer, wherein the adhesion enhancing layer is Palladium, the first electrical conducting layer is Nickel, and the substrate is composed of polyimide(PI).

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Patent Owner(s)

Patent OwnerAddress
ICHIA TECHNOLOGIES INCNO 268 HUAYA 2ND RD GUISHAN DIST TAOYUAN CITY 333

International Classification(s)

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  • 2013 Application Filing Year
  • H05K Class
  • 4677 Applications Filed
  • 4018 Patents Issued To-Date
  • 85.91 % Issued To-Date

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHAO, CHIH-MIN TAOYUAN COUNTY, TW 5 15
CHIANG, CHIA-HUA TAOYUAN COUNTY, TW 8 28
CHIU, CHIEN-HWA TAOYUAN COUNTY, TW 7 30
HSIAO, CHIH-CHENG TAOYUAN COUNTY, TW 22 37
JUANG, YUNG-CHANG TAOYUAN COUNTY, TW 3 10
KUAN, FENG-PING TAOYUAN COUNTY, TW 5 15
KUO, PEIR-RONG TAOYUAN COUNTY, TW 5 15
LEE, YING-WEI TAOYUAN COUNTY, TW 5 15

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges11592736014669463217161031301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0501001502002503003504004505005506006507007508008509009501000

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