MULTI-LAYER FLEXIBLE CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME
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United States of America Patent
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Issued Date -
Aug 14, 2014
app pub date -
Mar 28, 2013
filing date -
Feb 8, 2013
priority date (Note) -
Abandoned
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Abstract
The present invention provides a multi-layer flexible circuit board, comprising at least an electric circuit disposed on a vertical interval layer, wherein at least two sides of the electric circuit are covered by neighboring interval layer and another vertical interval composed layer of electric insulating material. The disclosure provides a non-pressing way to stack the multi-layer flexible circuit board, preventing fault crevice derived from a prior-known pressing way.
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