Prepregs and Laminates Having Homogeneous Dielectric Properties
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United States of America Patent
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Issued Date -
Aug 7, 2014
app pub date -
Mar 14, 2013
filing date -
Feb 6, 2013
priority date (Note) -
Abandoned
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Abstract
Resin compositions including one or more base resins and one or more high dielectric constant materials wherein the one or more high dielectric constant materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured Dk that matches the Dk of the reinforcing material to which the resin composition is to be applied to within plus or minus (±) 15% as well as prepregs and laminates made using the resin compositions.
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