METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE
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United States of America Patent
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Issued Date -
Aug 7, 2014
app pub date -
Jan 24, 2014
filing date -
Feb 4, 2013
priority date (Note) -
Abandoned
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Abstract
A method for manufacturing an LED package includes the steps: providing a lead frame including many pairs of first and second electrodes, the first electrodes and second electrodes each including a main body, an extension electrode, and a supporting branch, the first electrodes in a column and the second electrodes in a column being linearly connected by a first and second tie bars, respectively; forming many molded bodies to correspond to the pairs of the first and second electrodes, the first and second main bodies being embedded into the molded bodies, the first and second extension electrodes being exposed out from a periphery of the molded body, bottoms of the first and second supporting branches being exposed at a bottom of the molded body; disposing LED dies in corresponding receiving cavities; and cutting the first and second tie bars and the molded bodies and the lead frame.
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