ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS
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United States of America Patent
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Issued Date -
Aug 7, 2014
app pub date -
Dec 23, 2013
filing date -
Mar 17, 2008
priority date (Note) -
Abandoned
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Abstract
Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.
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